“BTI GB 502437285 (CE7 Plates) This is a ‘made to design’ part to be used as a sensor in the x-ray industry. We have spoken to the trade for guidance on this matter. This should not be declared in chapter 38 24 as this is not a chemical product. As per the example supplied this is also not a raw material. We originally showed tariff 90 22 900000 on the BTI application. On speaking to the trade we believe the correct classification is 85 41 900000. The plate which is manufactured specifically to a Teledyne DaIse design, ‘made to print ’. BTI GB 502436974 (CE6 Wafers) This is also a ‘made to design’ part to be used as a substrate for high brightness LED manufacture . This should not be declared in chapter 38 24 as this is not a chemical product. As per the example supplied this is also not a raw material. The correct classification of the CE6 wafer is 85 41 900000 as per the original submission.”
“The CE7 X-ray sensor substrate mount we ship to the customer will have a sensor bonded to one side and along with an electronic circuit board at one end. This was shown in the PowerPoint presentation and I attach the appropriate slide below. The sensor substrate mount with the attached sensor and circuit board, along with some other components is then housed in a unit similar to the one in the attached image. This is the completed X-ray sensor that our customer sells. To reiterate, the product that we are selling is a finished X-Ray sensor substrate mount that is an essential part of the X-ray sensor unit. The CE6 metallised wafer is supplied to the customer as a completed product ready to use. They then attach semiconducting layers to the substrate using a soldering (bonding) process. I have attached an image below which shows a typical production process for a LED die. Firstly, semiconducting layers are grown on a single crystal wafer substrate such as sapphire. A metallic bonding layer is then deposited on top of the semiconducting layers. Our CE6 wafers are not involved in these first steps. A high temperature bonding process is then used to solder Osprey's CE6 wafer to the sapphire wafer with the semiconducting layers. A laser process is then used to remove the sapphire wafer and the stack is flipped over so that the CE6; wafer is now the substrate (carrier) material. At this point the wafer will still be its original diameter as supplied by Osprey. The wafer and the attached semi-conducting layers are then diced up into many tens of thousands of individual LED devices. Each one of these devices is the light emitting component within an LED bulb and a part of each LED device will be from the CE6 wafer. There are semiconducting layers that are attached to the CE6 wafer. The CE6 wafer itself is not a semiconducting material. In fact, it is a very good conducting material and that is one of the reasons it is chosen as the substrate (carrier) for medium and high powder LEDs. As it is not semiconducting it is incorrect to think of it in the terms of a Si wafer where you would deliberately add dopants (impurities) to modify its electrical properties. CE6 wafers are binary Si-Al alloys containing 80% Si and 20% Al.”
‘Those more extensively worked (e.g. selective diffusion) fall in heading 8541 as semiconductor devices’
“1. Except where the context otherwise requires, the headings of the Chapter apply only to: (a) separate chemical elements and separate chemically defined compounds, whether or not containing impurities”
“Those more extensively worked (e.g. by selective diffusion) fall in heading 85.41 as semiconductor devices.”
“The heading also excludes chemical elements of Chapter 28 (for example, silicon and selenium) doped for use in electronics, in the form of discs, wafer, or similar forms, polished or not, whether or not coated with a uniform epitaxial layer, provided they have not been selectively doped or diffused to create discrete regions.”
“It is our opinion that the classification from HMRC is incorrect and that the correct tariff code for both the CE6 wafers and the CE7 X-ray detector plates is 841900000. We are appealing against this decision for the reasons outlined below. Tariffs highlighted for consideration in the departmental review: Chapter 38 Chapter 3818 - chemical elements doped for use in electronics in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics. HMRC excluded Osprey’s products from this category stating that, “they are neither chemical elements nor chemical compounds, but alloys….” which we accept is a correct reason for excluding the goods from this Chapter. In addition the products are not doped so do not meet the criteria for this category. Chapter 76 - aluminium and articles thereof. It is agreed that this Chapter is not pertinent to the goods in question i.e. wafers and x-ray detectors and are made from metal containing 70 – 80% silicon. These goods cannot be categorised as aluminium alloy because aluminium is a minority constituent, not the majority. Chapter 85 - diodes transistors and similar semiconductor devices; photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light emitting diodes; mounted piezoelectric crystals. Chapter 8541 - HMRC excludes the goods in question from this tariff stating that the goods have not been worked on extensively and also that silicon is excluded from Chapter 85. Both of the reasons for excluding the goods in question from Chapter 8541 are invalid, as outlined below. 1. The HMRC review concludes that “silicon is excluded from Chapter 85”
“Those more extensively worked (e.g. selective diffusion) fall in heading 8541 as semiconductor devices”